As military embedded systems depend more and more on software-based functionality, the demand for memory in which to run that software continues to climb. Virtium Technology has added the DDR3 MiniDIMMs and DDR3 VLP MiniDIMMs to their DDR3 high-density memory modules family. These new small footprint modules are now available at densities of 1 Gbyte, 2 Gbyte and 4 Gbyte, with future expansion to 8 Gbytes. The DDR3 MiniDIMM and DDR3 VLP MiniDIMM expands the current lineup of Virtium DDR3 memory, which includes DDR3 VLP Unbuffered Mini-DIMMs, VLP Registered Mini-DIMMs, SO-UDIMMs, SO-RDIMMs, Mini-UDIMMs and MiniRDIMMs.

The high-density, small-form-factor DDR3 MiniDIMM and DDR3 VLP MiniDIMM memory modules are well suited for vertically mounted space-constrained designs. All Virtium memory modules are available using monolithic DRAM that have an extended / industrial temperature range (-40° to 85°C), which makes them ideal as rugged AdvancedTCA memory (ATCA memory), AdvancedMC memory, MicroTCA memory, PicoTCA memory, AMC memory and COM Express memory for blades, SBB canisters or PICMG SBC applications.

Virtium Technology
Rancho Santa Margarita, CA.
(949) 888-2444.
[www.virtium.com].