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Acromag Expands Rugged I/O with mPCIe-Based AcroPack® Modules

Acromag has expanded its popular AcroPack® product line with a family of mPCIe-based rugged mezzanine I/O modules, engineered to deliver maximum I/O density and design flexibility for embedded computing systems. When paired with AcroPack carrier cards, these compact modules seamlessly integrate into platforms including PCIe, VPX, XMC, CompactPCI® Serial, PCIe/104, and Mini-ITX, offering developers a powerful way to consolidate diverse I/O functions in a single slot.

Designed for demanding defense, aerospace, and industrial applications, AcroPack modules support a wide range of functions including A/D and D/A conversion, digital I/O, Ethernet, counter/timers, serial communications, MIL-STD-1553, and FPGA-based customization. The rugged construction ensures reliable performance across a -40°C to +70°C operating range, while low-power consumption makes them ideal for SWaP-constrained systems.

With a mix-and-match architecture, engineers can combine multiple AcroPack types on one carrier to meet specific application requirements without costly redesigns. This modular approach accelerates development cycles, reduces integration complexity, and extends system lifecycle support.

By merging high density, rugged reliability, and standards-based versatility, Acromag’s mPCIe AcroPack® modules provide a future-ready solution for next-generation embedded I/O challenges.

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