Samtec Interconnects Selected for VITA 90 VNX+
VITA™ 90 VNX+™ is a new rugged, high-performance, small-form-factor standard, recently ratified by ANSI and VITA, for addressing the robust embedded computing requirements of UAVs, UUVs, missiles, satellites, and cube satellites commonly deployed in industrial, military, and aerospace applications. Samtec’s rugged, high-density, high-performance interconnects and alignment products were selected in accordance with the VITA 90 standard for use on both the plug-in module (PIM) and the backplane, enabling a SWaP alternative to 3U OpenVPX. VNX+ modules are a fraction of the size of existing OpenVPX modules.
Suitable for rugged, high-reliability system applications, VITA 90 VNX+ adheres to a modular open-systems design approach, providing system architects with a high-performance embedded computing platform for space-constrained, harsh-environment applications. The commonality of VNX+ PIM designs encourages interoperability, replaceability, and design reuse. This is validated through SOSA’s selection of this standard as their approved SFF PIM.
Form Factor & Connector Features
VITA 90 consists of several sub-standards, or dot specifications, each governing different domains of the SFF ecosystem. The base standard (90.0) specifies requirements for the plug-in module (PIM) and backplane for use in a compact, conduction-cooled chassis.
PIMs are approximately 89 x 78 mm in single or double heights. Single-height PIMs are 13 mm or 19 mm tall, and double-height PIMs are 27 mm or 39 mm tall. The high-speed data connector (HSDC) within the PIM is Samtec’s SEARAY™ high-speed 56 Gbps, high-density array. Configurations selected for the VITA 90 standard are 4-row and 8-row, with 200, 240, 320, or 400 total pins, allowing high-density design-in flexibility. The 320-Pin and 240-Pin connector configurations create additional space along the PIM’s connector face, enabling the integration of connector modules.
Connector modules, as outlined in VITA 90.2, support specialized contacts for coaxial and optical connections, further enhancing PIM-to-backplane adaptability and functionality. Coaxial contacts (Samtec’s GPCC-20 & GPCC-16 Series) are available with either 50 Ohm or 75 Ohm characteristic impedance for transmitting Radio Frequency (RF) and/or video signals via coaxial cable. Contacts are shrouded to protect from physical damage and foreign objects and debris (FOD), with frequency capabilities from DC to 110 GHz. Optical interfaces are 12- and 24-fiber MT ferrule slots, allowing the adoption of any suitable pluggable, rugged optics cable assembly, including Samtec’s FireFly™ optical transceivers. Power supply modules, as outlined in VITA 90.3, support conduction- and liquid-cooled environments for higher-output applications. Samtec’s SEARAY™ connector was selected for the mating interface due to its open-pin-field versatility and performance.
Samtec’s guide hardware supports VNX+ modules. The guidance system has a built-in ground pin for first mate last break capability, allowing a ground to be established before connection is made.