Extraordinary AI performance from -40 to +85 °C for rugged applications
congatec is expanding its portfolio of Computer-on-Modules (COMs) with Intel Core Ultra Series 3 processors to include variants for the extended industrial temperature range of -40 °C to +85 °C. With up to 180 TOPS of energy-efficient embedded computing performance, this high-performance module family is now also available for use in particularly demanding environments in AI-intensive markets, including industrial automation, robotics, medical, and retail point-of-sales.
With the support for the industrial temperature range, the COMs – offered as application-ready aReady.COMs – can be deployed in environments characterized by extreme temperature fluctuations, weather exposure, vibrations, or continuously demanding operating conditions. For extended ruggedness, congatec offers a Ready.YOURS customization services for value-adds, including conformal coating,special component selection, or burn-in tests. Like the conventional variants, the rugged derivatives also offer up to 16 CPU cores, up to 10 TOPS, and an integrated NPU5 for low-power AI inference, with up to 50 TOPS. Additionally, they feature up to 4 Xe3 cores for optimized GPGPU AI performance. Developers thus receive a scalable platform for high-performance embedded and edge systems that combines local AI processing, sensor fusion, automation functions, and safety-critical workloads, all delivered directly at the point of deployment with high ruggedness and energy efficiency.
The modules, therefore, address applications that require designs that are particularly reliable, rugged, and long-term available. Key applications include mission computers for autonomous or heavy-duty vehicles, as well as outdoor edge systems for smart cities, the energy and renewable sectors, wayside infrastructure, and railway applications.
With a comprehensive portfolio of module variants across different form factors, both new designs and upgrades of existing systems can be realized – from compact, energy-optimized platforms to high-performance solutions with high I/O bandwidth.