Intel announced a new technology that enables customers to significantly reduce the size, weight, power, and cost of systems used

Pentek, Inc. announced the newest member of its highly popular Jade® family of high-performance XMC FPGA modules. The Jade Model

3M and Pegatron have teamed up to develop a new Virtual Reality reference design headset with a folded optics lens.

Diamond Systems has introduced ATHENA IV, a wide-temperature, COM‐based SBC with integrated data acquisition and PC/104 I/O expansion. This combination

Pool GPUs and FPGAs, and compose them at native PCIe latency for the ultimate in data center agility, performance, and

Abaco Systems, Inc. announced the release of two boards, the SBC314C single-board computer, and the RAR15XC avionics data bus communications

The Black OEM from ViaLite is the latest in the Mil-Aero range of stand-alone RF over fiber modules. Operating in

Save Space with Configurable Functionality, Designed for a Wide Range of Applications Transtector Systems, an Infinite Electronics brand and an

Crystal Group, Inc. announced its increased focus on developing autonomous vehicle (AV) compute systems for industrial and military applications. Equipped

WIN Enterprises, Inc., a leading developer and a modifier of new and existing embedded x86 motherboards announces the PL-50300 series