Pixus Technologies offers a pluggable Tier 3 SOSA-aligned chassis management module for OpenVPX.
The SHM200 chassis manager for OpenVPX complies with VITA 46.11 for system management. The unit comes in 3U and 6U
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Core Systems shows their breath and width of manufacturing with the release of a rugged Voip Telephone.
Introducing the Rugged Cisco 8851 Telephone, a military-grade communication solution designed by Core Systems to thrive in challenging environments. Whether
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DDC-I and North Atlantic Industries Announce DAL A BSP
Support for Safety-Critical Deos RTOS Running on NAI’s 68PPC2 T2080 Multi-core OpenVPX Single Board Computer FACE-conformant avionics platform features bounded
Read MoreAvassa and OnLogic: Combining Software and Hardware for Industrial IoT Edge Excellence
Edge application management and operations platform provider Avassa (https://avassa.io/) and global industrial computer manufacturer OnLogic announce a partnership to offer
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VIAVI Unveils Groundbreaking Advances in 6G and AI Research with Introduction of 6G City-Scale Digital Twin and AI-Native Air Interface
Viavi Solutions Inc. shared milestones in 6G and AI research based on the Company’s 6G Forward Program. As 6G is
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PX5 Announces Functional Safety Certification of the PX5 RTOS, Offering Developers a Faster Path to Certification, Reducing Product Liability, Improving Quality and Time to Market
PX5 RTOS is the first RTOS presenting a native POSIX pthread API to be certified by SGS-TÜV Saar to the
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LDRA Elevates Its DevSecOps-Ready Platform with Actionable Security Analysis & Reporting
New security-first capabilities—including extended taint analysis and vulnerability heat maps —help embedded developers remediate critical issues earlier in the lifecycle.
Read MoreConcurrent Technologies Launches New VME Board
Concurrent Technologies, a designer and manufacturer of leading-edge computer products, systems, and mission-critical solutions used in high-performance markets by some
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mPCIe-based Rugged Mezzanine I/O Modules
AcroPack® mPCIe-based rugged mezzanine modules deliver maximum I/O density when used with AcroPack carrier cards for PCIe, VPX, XMC, CompactPCI®
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The faster, more sustainable route to dedicated high-end 3.5-inch systems
congatec presents the first board-level product in line with its recently introduced aReady. strategy. Application-ready for immediate deployment in industrial
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