Pixus Technologies, a provider of embedded computing and chassis solutions, has announced a new MIL rugged 19″ rackmount enclosure in a horizontal-loading configuration. The enclosures feature a front-to-rear airflow path.
The new Series of MIL rugged 19″ rackmount enclosures come in multiple sizes and configuration options. This includes sizes in 2U, 4U, 5U, 6U, and various depths. The enclosures support Rear Transition Modules (RTMs) and offer deeper sizes for mounting other devices. The designs are typically for 3U, 6U, or a hybrid mix of Eurocard-sized modules.
Pixus offers these enclosure systems in OpenVPX / SOSA(R) aligned, VME, and customizable form factors. The chassis is designed to MIL–STD-810 for shock/vibration/environmental conditions and MIL-STD-461 for EMI, and related specifications. Various power and I/O options are available. Side-to-side cooling is also optional.
