Altera Corporation, the industry’s largest pure-play FPGA solutions provider, announced engineering sample availability of its next-generation wideband Agilex® 9 Direct RF-Series SoC FPGAs. Designed to...
Qorvo® Advances X-Band Radar Performance with a More Efficient and Sensitive Compact Front-End Module
Qorvo, a leading global provider of connectivity and power solutions, introduced an X-band radar front-end solution that enables defense system designers to achieve higher performance...
New Series of Horizontal Loading MIL Rugged Rackmount Enclosures By Pixus
Pixus Technologies, a provider of embedded computing and chassis solutions, has announced a new MIL rugged 19" rackmount enclosure in a horizontal-loading configuration. The...
DITHD Introduces MGP173LC Series: Rugged Mobile KVM Console Built for Demanding Environments
Display Integration Technologies (DITHD) today announced the launch of the MGP173LC Series Rugged Mobile KVM Console, a new all-aluminum, high-brightness solution designed for mission-critical mobile...
Cambridge Pixel is announcing its innovative VSD-C2 display software.
Cambridge Pixel's VSD-C2 application bridges the gap between commercial-off-the-shelf (COTS) and bespoke command & control (C2) display software and is targeted at sensor and effector...
Socapex MIL-DTL-38999 Connectors for Battlefield Communications
Inelco Hunter is pleased to confirm the availability of the Amphenol Socapex MIL-DTL-38999 Series. The range includes circular connectors and cordsets, fiber-optic connectors, PCB connectors,...
Molex Expands Award-Winning AirBorn SInergy Modular High-Speed Hybrid Connectors with New High-Power Modules for All-in-One Connectivity
Molex announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors. The introduction of new heavy-duty, high-power contacts supports up to 25.0A...
Accelerating Technology: New GaN Chip for the Department of War Delivers on Performance in Record Time
Northrop Grumman's leadership in the Microelectronics Commons program led to the production of a breakthrough GaN chip that sets the pace for defense and commercial...
AAEON Outlines Plans for Four Intel Core Series 3-Powered Platforms
Following the release of the Intel Core Series 3 processors (formerly Wildcat Lake), AAEON has announced four upcoming platforms set to feature them. Following the...
Samtec Cable-to-Cable Interconnects Support High-Density AI Architectures
Samtec, Inc., announces the release of the ARJ6 cable-to-cable high-density panel-mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA...