RF technologies can now be integrated into the same subsystem with processing components. But doing so presents challenges in when accommodating the EMI shielding, space and mounting needs of those devices.
JUSTIN MOLL, EXECUTIVE SALES AND MARKETING CONSULTANT PIXUS TECHNOLOGIES
The battle to reduce size and weight in mil/aero embedded systems never ceases. In systems using RF devices there are multiple paths to reducing SWaP underway. One avenue is to switch to new board types either by using a smaller form factor module or by incorporating RF devices onboard existing architectures like VPX. But improved SWaP is being achieved with today’s standard architecture boards.