DOD Advances Microelectronics Commons to Build Domestic Semiconductor Industry, Workforce

February 2 marked the second week of Microelectronics Commons (Commons) Hubs visits for representatives from the Office of the Under Secretary of Defense for Research & Engineering (OUSD(R&E)), Naval Surface Warfare Center (NSWC)-Crane Division, and National Security Technology Accelerator (NSTXL). Representatives traveled to Massachusetts and New York, where they met with Hub leaders and members, as well as Governor Maura Healey and representatives from Congressional offices.

These visits showed that funding from the bipartisan “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” is directly contributing to the Commons becoming a community that empowers Hub members to create public-private partnerships, invest in infrastructure for microchip prototyping, and engage in multilateral co-operation – all in keeping with President Biden’s “Investing in America” agenda. 

CHIPS funding will continue to be allocated during Fiscal Years 2023 through 2027 to accelerate domestic microelectronics hardware prototyping and workforce development. This will grow local economies by upskilling local talent within each Hub region while complementing programs run by the Department of Commerce and the National Science Foundation. 

The Northeast Microelectronics Coalition Hub (NEMC) site visit on January 30 in Boston included delegates from Analog Devices, Applied Materials, NextFlex, Raytheon Technologies, Columbia University, MITRE, BAE Systems, as well as the Massachusetts Institute of Technology (MIT), and MIT Lincoln Labs. Governor Healey. Lieutenant Governor Kim Driscoll and Ms. Yvonne Hao, Secretary of Economic Development, also attended alongside representatives from the Offices of Senator Ed Markey and Congressman Seth Moulton. Congresswoman Lori Ann Trahan addressed the gathering virtually.