To help satellite OEMs streamline their system development work and reduce the time and engineering effort involved, Teledyne e2v and Texas Instruments (TI) collaborated on a new radiation-tolerant DDR4 modular platform. This field-proven hardware consists of a 4GB/8 GB DDR4T0xG72 DDR4 memory from Teledyne e2v and a TI TPS7H3301-SP DDR termination low drop-out (LDO) voltage regulator that provides a stable supply for the DDR4 module.
Optimized for implementations with acute size, weight, and power (SWaP) constraints to factor in, the DDR4/TPS7H3301-SP platform is very compact and convenient. The constituent components have already gone through comprehensive space characterization and qualification procedures to help designers achieve long-term operation without single event latch-up (SEL) and single event upset (SEU) issues arising.
This platform allows elevated levels of data storage capacity to be achieved inside a small form factor. It requires three times less PCB area versus solutions from the competition, and its volume is smaller by a factor of ten.
Versatility is another plus point, with the DDR4T0xG72/TPS7H3301-SP modular platform applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, NanoXplore, etc.) and custom-built ASICs.