Monitor and Analyze E1.S, E1.L and E3.x EDSFF NVMe® SSDs and CXL memory systems at up to 64GT/s
Teledyne LeCroy announced the availability of new PCI Express 6.0 EDSFF interposers, providing connectivity to Teledyne LeCroy’s PCI Express protocol analyzers using the latest PCIe 6.0 and CXL specifications for analysis of enterprise and datacenter small form factor (EDSFF) E1.S, E1.L, E3.x type solid-state drives (SSDs) and devices. These new interposers are based on the new Teledyne LeCroy TAP6 technology that reduces signal integrity issues for enhanced probing in high-speed projects.
EDSFF devices designed for high-performance systems comprise a significant and growing segment of the enterprise and data center storage devices market. Now design and test engineers can test, identify issues, and optimize EDSFF (E1.S, E1.L, E3.x) type memory systems and solid-state drive performance using Teledyne LeCroy PCIe 6.0 EDSFF interposers. Based on the PCIe 6.0, NVMe, and CXL specifications, the EDSFF interface can support speeds of up to 64GT/s.
These new Teledyne LeCroy PCIe 6.0 EDSFF Interposers support data rates of 2.5, 5.0, 8.0, 16.0, 32.0, and 64.0 GT/s with up to x16 link widths. It provides a simple, easy-to-use way to probe PCIe traffic between a host and an add-in card. In combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers, the interposer now enables engineers to test product designs to 32 GT/s. Future Summit protocol analyzers, coming soon, will use the full potential of the PCIe 6.0 EDSFF Interposer at full 64 GT/s speeds.