Crane Aerospace & Electronics Launches New Interpoint® xMOR Product Family

Crane A&E’s 120W DC-DC converter product family offers deep space, new space, Class H defense, and COTS power conversion solutions.

Crane Aerospace & Electronics, a segment of Crane Company, has launched a new 120-watt family of power conversion products called the Interpoint® xMOR. The Interpoint® xMOR product family features four DC-DC power converters with a shared core architecture, each tailored to address different aerospace and defense market needs.

Crane A&E’s xMOR product family includes its new cMOR (Hi-Rel COTS), hMOR (Class H high-reliability), sMOR (Class K deep space), and rMOR (new space) power converters. The cMOR is a high-reliability, commercial off-the-shelf offering for aerospace and defense applications. The hMOR converter is designed for mission-critical defense applications, is Class H certified, and features high efficiency. Crane A&E’s sMOR supports deep space applications, is Class K certified, and features high performance and a 19-50V input range. Finally, the rMOR is designed to support the rapidly growing New Space market – featuring up to 92% efficiency in a radiation tolerant design tested to 30krad and 43MeV.

“We are proud to build from the rich heritage of our Interpoint® brand and offer a new range of innovative solutions with our new xMOR product family,” said Ashley Smith, Crane A&E Vice President & GM, Modular Power. “As the space and defense markets continue to evolve, customers seek improved capabilities specifically designed for their applications and missions. We have introduced this new family of highly efficient 120W converters to allow customers to choose solutions that best meet the needs of their missions – solutions that feature Interpoint’s known quality, reliability, and patented technology. We’ve designed this new product line to enable customers to leverage similar power system designs across platforms via our family architecture that delivers high-reliability power converters with the same size packaging and pin-for-pin capability.”

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